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| IC595 Series Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: Dual Inline Memory Module (DIMM, 184 & 240 pins) Part Number (Details) 1,000M W min. at 500V DC 700V AC for 1 minute 30m W max. at 10mA/20mV max. -55C to +170C 10,000 insertions minimum 184 contact pins IC-595 - * - MF Series No. 1 = 184 Pins 2 = 240 Pins MF = Flanged Unmarked = Not Flanged Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features i Card thickness 1.27mm i For 184 contact pins with 1.00mm pitch Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 162.70 0.1 122.00 0.2 1.00x45=45.00 0.2 AE3.20 Thru hole 11.500.1 32.00 0.2 1.00x45=45.00 0.2 1.00x45=45.00 0.1 1.000.05 122.0 0.1 32.0 0.1 1.00x45=45.00 0.1 184-AE0.80 Thru hole + 0.1 0 17.00 13.00 8.000.05 1.00 0.15 108.00 + 0.2 0 1.00 0.1 4.800.05 1.00 0.05 AE3.20 0 Thru hole + 0.1 153.70 0.4 162.70 0.2 171.70 0.4 Matching Module Dimensions 153.70 ref 128.00 ref 3.00 15.48 0.1 6.00 2.000.1 34.10 11.00 4.00 Section "A" 4.000.15 17.78 2.990.05 4.50 1.00x45=45.00 0.1 3.00 3.50 0.5 w0.30 x t0.30 11.50 27.50 102.87 133.350.15 1.00x45=45.00 0.1 1.270.1 1.60 -0.1 0 R 0.80 2.300.1 Section "A" 0.80 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Test & Burn-In B-5 |
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